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US 2013/0279232 A1Published application
Apparatus, system, and method for transferring heat from memory components
AssigneeFusion-Io, Inc.
InventorsDavid Sharette, Kris Nosack
Life of this patent
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Abstract
The apparatus to transfer heat from memory components includes a first non-volatile memory component and a second non-volatile memory component. The apparatus includes a heat spreading material in thermal communication with the first non-volatile memory component and the second non-volatile memory component. The heat spreading material is configured to transfer heat from the first non-volatile memory component and the second non-volatile memory component.
Claims25
An apparatus comprising:
- one or more substrates;
- a plurality of non-volatile memory chips disposed in an array on the one or more substrates, the one or more substrates providing mechanical support and electrical connections for the plurality of non-volatile memory components;
- and
- a graphite sheet disposed adjacent to the plurality of non-volatile memory chips, the graphite sheet comprising an elongate sheet configured to transfer heat from the plurality of non-volatile memory chips.
1 more element
An apparatus comprising:
- a first non-volatile memory component;
- a second non-volatile memory component;
- and
- a heat spreading material in thermal communication with the first non-volatile memory component and the second non-volatile memory component, the heat spreading material configured to transfer heat from the first non-volatile memory component and the second non-volatile memory component.
1 more element
A system comprising:
- one or more substrates;
- a hardware controller disposed on the one or more substrates;
- a first non-volatile memory component disposed on the one or more substrates;
- a second non-volatile memory component disposed on the one or more substrates;
- and
- a thermally conductive material in thermal communication with the first non-volatile memory component and the second non-volatile memory component, the thermally conductive material configured to decrease heat in one of the first non-volatile memory component and the second non-volatile memory component.
3 more elements
A method comprising:
- disposing a first non-volatile memory component on one or more substrates;
- disposing the second non-volatile memory component on the one or more substrates;
- and
- placing a heat spreading material in thermal communication with the first non-volatile memory component and the second non-volatile memory component such that the heat spreading material is configured to transfer heat from the first non-volatile memory component and the second non-volatile memory component.
1 more element
Dependencies are inferred from the claim text.