US 2013/0279089 A1Published application

Cover, electronic device and manufacturing method for cover

AssigneeHTC Corporation

InventorsShih-Po Chien, Hsien-Wei Juan, I-Cheng Chuang, Yi-Ting Liu, Chih-Kai Hu, Chun-Lung Huang, Pi-Lin Lo, Yi-Fan Hsueh

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Abstract

A cover, an electronic device and a method for manufacturing the cover are provided. The electronic device includes a body and a cover. The cover is disposed on the body, and includes a substrate, an adhesive layer and a color layer. The substrate has a thinning region. The color layer is disposed in the thinning region and is located between the substrate and the adhesive layer.

Claims21

Dependent claims

A cover, comprising:

a substrate, having a thinning region;
an adhesive layer;
and
a color layer, disposed in the thinning region and located between the substrate and the adhesive layer.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 13/650,126Filed 11 Oct 2012
Priority: 5 Jan 2012
Published: 24 Oct 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H05K 13/00
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric
G06F 1/1626
For portable computers: with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
H04M 1/0202
Constructional features of telephone sets: portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
H05K 7/005
Constructional details common to different types of electric apparatus: arrangements of circuit components without supporting structure

Family

Application61/583,561Us provisional application · filed 5 Jan 2012
US 2013/0279089 A1This patent

From the US filing history. Foreign family members aren’t listed.

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