Piezoelectric device and method for fabricating the same

A method for fabricating a surface mount piezoelectric device, comprising:

• preparing a plurality of piezoelectric vibrating pieces including a vibrating portion that vibrates at a predetermined vibration frequency;
• preparing a base wafer including a plurality of base plates;
• forming a metal film on one principal surface of the base wafer by sputtering or vacuum evaporation;
• preparing a lid wafer including a plurality of lid plates;
• placing the plurality of piezoelectric vibrating pieces on the other principal surface of the base wafer;
• bonding the other principal surface of the lid wafer to the other principal surface of the base wafer so as to seal the vibrating portion;
• and
• forming a metal film on one principal surface of the lid wafer after the preparing of the lid wafer and before the placing or after the bonding;
• and
• applying electroless plating on the metal film of the base wafer and the metal film of the lid wafer, wherein
• the electroless plating film formed on the lid wafer has a same shape and a same area as a shape and an area of the electroless plating film of the base wafer.

A method for fabricating a surface mount piezoelectric device, comprising:

• preparing a piezoelectric wafer that includes a plurality of piezoelectric vibrating pieces including a vibrating portion that vibrates at a predetermined vibration frequency, a framing portion for surrounding the vibrating portion, and a connecting portion for connecting the vibrating portion and the framing portion;
• preparing a base wafer including a plurality of base plates;
• forming a metal film on one principal surface of the base wafer by sputtering or vacuum evaporation;
• preparing a lid wafer including a plurality of lid plates;
• bonding the base wafer and the piezoelectric wafer so as to place the respective piezoelectric vibrating pieces on the other principal surface of the base plate;
• bonding the other principal surface of the lid wafer to the other principal surface of the piezoelectric wafer so as to seal the vibrating portion;
• and
• forming a metal film on one principal surface of the lid wafer after the preparing of the lid wafer and before the placing or after the bonding;
• and
• applying electroless plating on the metal film formed on the one principal surface of the base wafer and the metal film of the lid wafer, wherein
• the electroless plating film formed on the lid wafer has a same shape and a same area as a shape and an area of the electroless plating film of the base wafer.