Tuning the Efficiency in the Transmission of Radio-Frequency Signals Using Micro-Bumps

A device comprising:

• a device die comprising:
• a main circuit;
• an electrostatic discharge (ESD) circuit;
• a first bond pad coupled to the main circuit and the ESD circuit;
• and
• a second bond pad coupled to an electrical ground and adjacent to the first bond pad, wherein the first bond pad and the second pad are electrically disconnected from each other;
• a work piece comprising:
• a third bond pad bonded to the first bond pad;
• and
• a fourth bond pad bonded to the second bond pad, wherein the fourth bond is configured to be electrically floating when not bonded to the second bond pad;
• and
• a load device electrically coupled to the third bond pad, wherein the third bond pad is electrically coupled between the first bond pad and the load device.

A device comprising:

• a device die comprising:
• a main circuit;
• an electrostatic discharge (ESD) circuit;
• and
• a first bond pad array comprising:
• a first bond pad coupled to the main circuit and the ESD circuit;
• a second bond pad coupled to an electrical ground;
• and
• a third bond pad;
• and
• a work piece comprising a second bond pad array comprising:
• a fourth bond pad bonded to the first bond pad;
• a fifth bond pad bonded to the second bond pad, wherein the fifth bond pad is configured to be electrically floating when not bonded to the second bond pad;
• and
• a sixth bond pad bonded to the third bond pad, wherein the third bond pad and the sixth bond pad are electrically floating.