MEMS Device Structure and Methods of Forming Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChang-Chia Chang, Chen-Chih Fan, Bruce C.S. Chou
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Abstract
A microelectromechanical system (MEMS) device may include a MEMS structure above a first substrate. The MEMS structure comprising a central static element, a movable element, and an outer static element. A portion of bonding material between the central static element and the first substrate. A second substrate above the MEMS structure, with a portion of a dielectric layer between the central static element and the second substrate. A supporting post comprises the portion of bonding material, the central static element, and the portion of dielectric material.
Claims20
A method for forming a microelectromechanical system (MEMS) device comprising:
- forming a MEMS structure over a first substrate, wherein the MEMS structure comprises a movable element and an adjacent static element;
- forming a cavity surrounding the movable element;
- forming an interconnect structure on a second substrate;
- depositing a first dielectric layer on the interconnect structure;
- and
- bonding the MEMS structure to the first dielectric layer, wherein the static element forms a first supporting post in the cavity, the first supporting post configured to support the second substrate.
A method of forming a MEMS device comprising:
- forming an interconnect structure on a first substrate;
- depositing a dielectric layer on the interconnect structure;
- patterning the dielectric layer to form a central portion and two outer portions;
- bonding a MEMS wafer to the patterned dielectric layer;
- patterning the MEMS wafer to form a movable element, a central static element, and an outer static element, the movable element encircling the central static element, and the outer static element encircling the movable element;
- depositing a first bonding material on the central static element and the outer static element;
- forming two recesses in a second substrate, wherein the recesses form a central raised portion of the second substrate and two outer raised portions of the second substrate;
- depositing a second bonding material on the central raised portion and the outer raised portions of the second substrate;
- and
- bonding the MEMS wafer to the second substrate, wherein the central portion of the dielectric layer, the central static element, the first bonding material on the central static element, the second bonding material on the central raised portion, and the central raised portion form a first supporting post.
A MEMS device comprising:
- a MEMS structure above a first substrate, wherein the MEMS structure comprises a movable element, a central static element, and an outer static element, wherein the movable element is suspended above the first substrate, the movable element is laterally separated from the outer static element by a first spacing, and the movable element is laterally separated from the central static element by a second spacing;
- a central portion of a bonding material between the first substrate and a bottom surface of the central static element;
- a second substrate above the MEMS structure;
- a central portion of a first dielectric layer between the second substrate and a top surface of the central static element;
- and
- a supporting post, the supporting post comprising:
- the central portion of the bonding material, the central static element, and the central portion of the first dielectric layer.
Dependencies are inferred from the claim text.