Package structure of light emitting device

A package structure of a light emitting device, comprising:

• a light emitting device;
• a leadframe for supporting the light emitting device, wherein the leadframe has a top surface, a bottom surface and a side surface located between the top surface and the bottom surface and having a first dimension in a length direction of the leadframe;
• and
• a cup structure made of thermosetting resin and disposed on the leadframe, wherein a sidewall of the cup structure covers the side surface and has a first connecting profile length in the length direction with respect to the side surface, and the first connecting profile length is larger than the first dimension of the side surface.

A package structure of a light emitting device, comprising:

• a light emitting device;
• a leadframe for supporting the light emitting device, wherein the leadframe has a top surface, a bottom surface and a plurality of openings passing through the top surface and the bottom surface, each opening has a first dimension in a length direction of the leadframe, and the interval between two adjacent openings in the length direction is at least larger than two times of the first dimension;
• and
• a cup structure made of thermosetting resin and disposed on the leadframe, wherein a sidewall of the cup structure covers a portion of the top surface and has a plurality of engaging members extended downward from the top surface and inserted into corresponding openings.