Package and method for manufacturing package

A package for mounting a light emitting element, the package comprising:

• a housing including an upper surface, a lower surface, and a side surface;
• a flat plate-shaped electrode including a lower surface and an upper surface, wherein the lower surface of the electrode is exposed from the lower surface of the housing, and the upper surface of the electrode includes a mounting area on which the light emitting element is mounted;
• an insulator arranged on a periphery of the upper surface of the electrode;
• a frame-shaped element connector connected to an upper surface of the insulator;
• a tubular reflective portion that extends from a periphery of the element connector to a height corresponding to the upper surface of the housing;
• a terminal arranged on the side surface of the housing and connected to the reflective portion;
• and
• a recess that accommodates the light emitting element, wherein the recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.