Stacked led device with diagonal bonding pads

A method for forming a semiconductor light emitting device, comprising:

• providing a first epitaxial structure over a substrate, the first epitaxial structure comprising a first doped layer, a first light emitting layer, and a second doped layer;
• providing a second epitaxial structure over a first temporary substrate, the second epitaxial structure comprising a third doped layer, a second light emitting layer, and a fourth doped layer;
• bonding the second epitaxial structure to a second temporary substrate;
• removing the first temporary substrate from the second epitaxial structure;
• bonding the first epitaxial structure to the second epitaxial structure using an adhesive layer;
• and
• removing the second temporary substrate from the second epitaxial structure.

A light emitting diode array, comprising:

• two or more light emitting diode modules formed on a substrate, wherein each light emitting diode module comprises:
• a first epitaxial structure over the substrate, the first epitaxial structure comprising a first doped layer, a first light emitting layer, and a second doped layer;
• a first electrode coupled to the first doped layer;
• a second electrode coupled to the second doped layer that faces the same direction as the first electrode;
• a second epitaxial structure comprising a third doped layer, a second light emitting layer, and a fourth doped layer;
• a third electrode coupled to the third doped layer that faces the same direction as the first electrode;
• a fourth electrode coupled to the fourth doped layer that faces the same direction as the first electrode;
• and
• an adhesive layer between the first epitaxial structure and the second epitaxial structure;
• wherein one of the first electrode and the second electrode of one light emitting diode module is coupled to one of the first electrode and the second electrode of an adjacent light emitting module;
• and
• wherein one of the third electrode and the fourth electrode of one light emitting diode module is coupled to one of the third electrode and the fourth electrode of an adjacent light emitting module.