Organic electronic device structures and fabrication methods
AssigneeCambridge Display Technology Limited
InventorsHaydn Gregory, Julian Carter
Life of this patent
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Abstract
An organic electronic device structure, the structure comprising: a substrate; a base layer supported by said substrate and defining the base of a well for solvent-based deposition of organic electronic material; one or more spacer layers formed over said base layer; a bank layer formed over said spacer layer to define a side of said well; and wherein an edge of said well adjacent said base layer is undercut to define a shelf over said base layer, said shelf defining a recess to receive said organic electronic material.
Claims17
A method of forming a droplet deposition well in a structure for droplet-deposition-based fabrication of a organic electronic device, the method comprising:
- depositing onto a substrate, a layer of hydrophilic material;
- depositing a layer of bank material over said layer of hydrophilic material;
- patterning said layer of bank material to define banks forming one or more of said droplet deposition wells;
- and
- etching said layer of hydrophilic material in a self-aligned process using said patterned layer of bank material as a mask, wherein said bank material comprises a resist material, the method further comprising employing a resist stripping procedure after said etching to expose part of an upper surface of said etched layer of hydrophilic material adjacent a base of a said bank forming one or more of said droplet deposition wells.
A method of forming a droplet deposition well in a structure for droplet-deposition-based fabrication of a organic electronic device, the method comprising:
- depositing onto a substrate, a layer of hydrophilic material;
- depositing a layer of resist material over said layer of hydrophilic material;
- patterning said layer of resist material to define banks forming one or more of said droplet deposition wells;
- patterning said layer of hydrophilic material to remove said hydrophilic material from at least part of a base area of said one or more droplet deposition wells;
- and
- using a resist stripping procedure to expose part of an upper surface of said patterned layer of hydrophilic material adjacent a base of a said bank forming one or more of said droplet deposition wells.
A method as claimed in 2 further comprising fabricating said organic electronic device by depositing dissolved organic electronic material using a droplet deposition process into a said droplet deposition well.
A organic electronic device comprising a substrate bearing a patterned layer of hydrophilic material beneath a plurality of droplet deposition wells filled with organic electronic material, wherein part of an upper surface of said patterned layer of hydrophilic material adjacent a base of a said bank forming one or more of said droplet deposition wells is exposed to said organic electronic material.
A organic electronic device structure, the structure comprising:
- a substrate;
- and
- a bank layer supported by said substrate and defining a well for solvent-based deposition of organic electronic material;
- and
- wherein said structure further comprises a fillet layer patterned to define a fillet at an inside edge of said well and at the base of said well.
A organic electronic device structure as claimed in claim 13 comprising at least two said step layers patterned to define a double step at said inside edge of said well for said fillet.
A method of fabricating a organic electronic device on a substrate bearing at least one well for solvent-based deposition of organic electronic material, the method including depositing a fillet layer and anisotropically etching said fillet layer to define a fillet at an inside edge of said well prior to solvent-based deposition of said organic electronic material for fabricating said device.
Dependencies are inferred from the claim text.