Non-volatile semiconductor memory device and method for manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsJun NISHIMURA, Nobuaki Yasutake, Kei Sakamoto, Takayuki Okamura
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Abstract
A non-volatile semiconductor memory device includes a cell array layer including a first wire, one or more memory cells stacked on the first wire, and a second wire formed on the memory cell so as to cross the first wire, wherein the memory cell includes a current rectifying element and a variable resistance element, and an atomic composition ratio of nitrogen is higher than that of oxygen in a part of a sidewall of the current rectifying element.
Claims20
A non-volatile semiconductor memory device comprising a cell array layer including a first wire, one or more memory cells stacked on the first wire, and a second wire formed on the memory cell so as to cross the first wire, wherein
- the memory cell includes a current rectifying element and a variable resistance element, and
- an atomic composition ratio of nitrogen is higher than that of oxygen in a part of a sidewall of the current rectifying element.
A non-volatile semiconductor memory device comprising a cell array layer including a first wire, one or more memory cells stacked on the first wire, and a second wire formed on the memory cell so as to cross the first wire,
- the memory cell including a current rectifying element and a variable resistance element,
- the current rectifying element being connected to the first wire via a first electrode,
- the variable resistance element being connected to the current rectifying element via a second electrode and being connected to the second wire via a third electrode, and
- the current rectifying element, the variable resistance element, and the first to third electrodes being provided on a side surface thereof with a sidewall nitrided layer.
A method for manufacturing a non-volatile semiconductor memory device including a cell array layer including a first wire, a memory cell stacked on the first wire, and a second wire formed on the memory cell so as to cross the first wire, the memory cell including a current rectifying element and a variable resistance element, comprising:
- forming a first wiring layer forming the first wire;
- forming above the first wiring layer a semiconductor layer forming the current rectifying element and a variable resistance element layer forming the variable resistance element;
- selectively removing the variable resistance element layer and the semiconductor layer;
- and
- performing a nitridation of sidewalls of the variable resistance element layer and the semiconductor layer.
The method for manufacturing a non-volatile semiconductor memory device according to claim 19,
- wherein the nitridation of the sidewall of the second wire is performed sufficiently to protect the second wire from abnormal oxidation caused by steam oxidation.
Dependencies are inferred from the claim text.