Method and apparatus for observing defects
AssigneeHitachi High-Technologies Corporation
InventorsYuko Otani, Yuta Urano, Toshifumi Honda
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AssigneeHitachi High-Technologies Corporation
InventorsYuko Otani, Yuta Urano, Toshifumi Honda
Estimating the term…
Disclosed are a method and an apparatus for observing defects by using an SEM, wherein, in order to observe defects on a wafer at high speed and high sensitivity, positional information of defects on a sample, which has been optically inspected and detected by other inspecting apparatus, and information of the conditions of the optical inspection having been performed by other inspecting apparatus are obtained, and optically detecting the defects on the sample placed on a table, on the basis of the thus obtained information, and on the basis of the detected positional information of the defect on the sample placed on the table, the positional information of the defect having been inspected and detected by other inspecting apparatus is corrected, then, the defects on the sample placed on the table are observed by the SEM using the thus corrected positional information of the defects.
A defect observing method comprising:
A defect observing method comprising the steps of:
A defect observing apparatus comprising:
Dependencies are inferred from the claim text.