Manufacturing method of circuit board

A manufacturing method of a circuit board, comprising:

• providing a first core layer, a second core material layer, and a central dielectric material layer, wherein the first core layer comprises a core dielectric layer and a core circuit layer, the core circuit layer is disposed on the core dielectric layer, the second core material layer is disposed on the first core layer, and the central dielectric material layer is disposed between the first core layer and the second core material layer;
• pressing the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure, wherein the composite circuit structure has a pre-removing area, and at least a portion of the core circuit layer is located within the pre-removing area;
• removing a portion of the central dielectric material layer located at a periphery of the pre-removing area and a portion of the second core material layer located at the periphery of the pre-removing area;
• and
• removing a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer.