Photovoltaic silicone encapsulant and photovoltaic module
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHiroto Ohwada, Tomoyoshi Furihata, Atsuo Ito, Hyung-Bae Kim, Naoki Yamakawa, Atsushi Yaginuma
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Abstract
A silicone composition for photovoltaic encapsulation is prepared by blending (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups per molecule, (B) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule, and (C) an addition reaction catalyst such that the composition when cured may have a water vapor permeability of 80-160 g/m2·day at 40° C. and a thickness of 1 mm.
Claims3
In connection with a photovoltaic module comprising a photovoltaic cell having a front surface on which solar light is incident and a back surface, a front glass plate on the front surface, and a backsheet or back glass plate on the back surface,
- a silicone composition for encapsulating the photovoltaic cell comprising
- (A) 100 parts by weight of an organ containing at least two silicon-bonded alkenyl groups per molecule, represented by the average compositional formula (1)
- RaR′bSiO(4-a-b)/2 (1)
- wherein R is alkenyl, R′ is a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms free of aliphatic unsaturation, a and b are numbers in the range:
- 0<a≦2, 0<b<3, and 0<a+b≦3,
- (B) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule, in such an amount that a molar ratio of silicon-bonded hydrogen in component (B) to silicon-bonded alkenyl in component (A) may be in a range of 0.4/1 to 2.5/1, and
- (C) a catalytic amount of an addition reaction catalyst,
- the silicone composition, when cured, having a water vapor permeability of at least 80 g/m2·day at 40° C. and a thickness of 1 mm.
Dependencies are inferred from the claim text.