A lower supporting pin layout determination method for determining whether or not an lower supporting pin which receives a downside of a substrate is correctly arrayed in an electronic parts mounting apparatus that mounts electronic parts on the substrate hold by a substrate holding section, wherein the lower supporting pin has a shape including a base to be supported by a support plate placed in the substrate holding section, a shaft extending upward from the base, a smaller-diameter section that is on an upper portion of the shaft and in which an outer diameter of the shaft becomes smaller, and a contact surface that is formed on top of the smaller-diameter section and that contacts and receives a downside surface of the substrate, the method comprising:
- an imaging step of capturing an image of the lower supporting pin from above, to thus acquire a planar image;
- a shaft shape detection step of subjecting the image to recognition processing, to thus detect an outer shape of the shaft at a recognition reference position set at a height where a transition occurs from an outer periphery of the shaft to the smaller-diameter section;
- and
- a pin layout determination step of comparing a planar position of the lower supporting pin determined from the detected outer shape with preset pin layout data, thereby determining whether or not the lower supporting pin is correctly arrayed.