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AssigneeHitachi Chemical Company, Ltd.
InventorsKouhei Taniguchi, Takayuki Matsuzaki, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta, Rie Katou
Estimating the term…
In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes.
A wafer processing tape pasted to a wafer ring to be used when processing a semiconductor wafer,
A dicing tape pasted to a wafer ring to be used when dicing a semiconductor wafer,
A method of manufacturing a wafer processing tape pasted to a wafer ring to be used when processing a semiconductor wafer,
Dependencies are inferred from the claim text.