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AssigneeDai Nippon Printing Co., Ltd.
InventorsYasuhiro Ookawa, Akiko Amano
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The imprint process of the invention includes at least an adhesion layer-formation step, a filling step, a curing step, and a releasing step. In the adhesion layer-formation step, an adhesive including a compound including in one molecule a tetravalent atom having one hydrolysable group and two inert group, and a reactive functional group bonded to the atom is brought into contact with a substrate blank that is then scrubbed thereby forming an adhesion layer on the substrate blank to prepare a transfer substrate. In the filling step, a mold is located in proximity to the transfer substrate with a work-material interleaved between the mold and the adhesion layer to fill the work-material up in a transfer shape area of the mold; in the curing step, the work-material is cured; and in the releasing step, the mold is released off from the work-material.
An imprint process for transferring a shape of a desired transfer shape area that a mold has onto a work-material while said work-material is interleaved between said mold and a transfer substrate blank, comprising:
An imprinting transfer substrate comprising a substrate blank and an adhesion layer positioned on said substrate blank, wherein said adhesion layer includes a tetravalent atom bonded to said substrate blank via an oxygen atom and having two inert groups, and a reactive functional group bonded to said tetravalent atom, and has no bumps of more than 5 nm in height.
7-12. (canceled)
Dependencies are inferred from the claim text.