Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package

A microelectronic assembly comprising:

• an integrated circuit package;
• a socket compatible with the integrated circuit package;
• and
• an independent loading mechanism,
• wherein:
• the integrated circuit package comprises:
• a die;
• a first substrate;
• a second substrate;
• and
• a heat spreader that makes contact with both the first substrate and the second substrate;
• the heat spreader comprises a step providing a contact surface;
• and
• the independent loading mechanism makes contact with the heat spreader at the contact surface.

A microelectronic system comprising:

• a system board;
• a first microelectronic package having a first height;
• a second microelectronic package having a second height different from the first height;
• and
• a heat spreader that makes contact with both the first microelectronic package and the second microelectronic package.

A method of reducing die stress in a microelectronic package the method comprising:

• mounting a die on a first substrate;
• mounting the first substrate on a second substrate that has a footprint larger than the first substrate;
• providing a heat spreader that has a top side and a bottom side, wherein the bottom side has a first substrate contact area and a second substrate contact area;
• and
• mounting the heat spreader on the first substrate and the second substrate such that the first substrate contact area makes contact with the first substrate and the second substrate contact area makes contact with the second substrate.