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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYen-Chang Hu, Ching-Wen Hsiao, Chih-Hua Chen, Chen-Shien Chen, Tin-Hao Kuo
Estimating the term…
Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed.
A package comprising:
A method of packaging a device comprising:
A package on package (POP) device configured to be mounted to a substrate, the POP device having a nominal top and a nominal bottom, wherein the nominal top is distant from a substrate when the POP device is mounted to the substrate and the nominal bottom is proximate the substrate when the POP device is mounted to the substrate, the POP device comprising:
Dependencies are inferred from the claim text.