Carrier head for chemical mechanical polishing system

A carrier head for a chemical mechanical polishing system, comprising:

• a base;
• a substrate receiving member connected to a lower part of the base, having an outer surface against which a substrate can be mounted;
• a bladder positioned inside of the substrate receiving member and connected to the lower part of the base, wherein the bladder can apply pressure to a predetermined area of an inner surface of the substrate receiving member by expanding and contacting the inner surface;
• and
• at least one wall structure connected to the lower part of the base, wherein the at least one wall structure can limit a lateral expansion of the bladder.

A substrate receiving member used in a carrier head for a chemical mechanical polishing system, comprising:

• a plate portion providing an outer surface for receiving a substrate;
• a vertical perimeter portion extending from the plate portion, wherein the vertical perimeter portion forms an angle of 84° to 96° with respect to the plate portion;
• and
• an inclined perimeter portion extending from the vertical perimeter portion, wherein the inclined perimeter portion extends outwardly forming an angle of 6° to 40° with respect to the vertical perimeter portion.