Substrate processing apparatus and substrate processing method
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsHirofumi MASUHARA, Kenichiro ARAI, Masahiro MIYAGI, Toru ENDO
Life of this patent
Estimating the term…
Loading patent…
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsHirofumi MASUHARA, Kenichiro ARAI, Masahiro MIYAGI, Toru ENDO
Estimating the term…
In a substrate processing apparatus, with an internal space of a chamber brought into a reduced pressure atmosphere, a first processing liquid is supplied onto an upper surface of a substrate while the substrate is rotated, and the first processing liquid is thereby quickly spread from a center portion toward a peripheral portion on the upper surface of the substrate. It is thereby possible to coat the upper surface of the substrate with the first processing liquid in a shorter time as compared with under normal pressure. Further, by sucking the first processing liquid from the vicinity of an edge of the substrate, it is possible to coat the upper surface of the substrate with the first processing liquid in a still shorter time. As a result, it is possible to shorten the time required for the processing of the substrate.
A substrate processing apparatus for processing a substrate, comprising:
A substrate processing method of processing a substrate, comprising the steps of:
Dependencies are inferred from the claim text.