Polishing liquid and method for polishing substrate using the polishing liquid

A polishing liquid for chemical mechanical polishing comprising cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group, and water,

• wherein the organic acid A has at least one group selected from the group consisting of —COOM group, -Ph-OM group, —SO3M group and —PO3M2 group (where, M is at least one selected from the group of H, NH4, Na and K, and Ph represents a phenyl group which may have a substituent),
• pKa of the organic acid A is less than 9,
• a content of the organic acid A is 0.001 to 1 mass % with respect to the total mass of the polishing liquid,
• a content of the polymer compound B is 0.01 to 0.50 mass % with respect to the total mass of the polishing liquid, and
• pH is in the range of 4.0 to 7.0.