Method and apparatus for reducing package warpage

A method of flattening a packaged structure, comprising:

• placing the packaged structure having warpage between an upper flat plate and a lower flat plate of a flattening apparatus, wherein the packaged structure is protected by an upper protection layer against the upper flat plate of the flattening apparatus, and wherein the upper protection layer is not continuous and is placed on protruding portions of the packaged structure;
• applying a pressure on the packaged structure by the flattening apparatus to flatten the packaged structure;
• and
• applying a thermal profile on the flattening apparatus.

An apparatus for flattening a packaged structure, comprising:

• an upper flat plate;
• a lower flat plate;
• an upper protection layer next to the upper flat plate;
• and
• a lower protection layer next to the lower flat plate, wherein the apparatus is configured to flatten the packaged structure placed between the upper protection layer and the lower protection layer, and wherein the packaged structure has exposed conductive connectors adapted to be protected by at least one of the upper protection layer or the lower protection layer against the corresponding upper or lower flat plate.