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US 2013/0259738 A1Published application
Low Melting Temperature Solder Alloy
OwnerPolina SNUGOVSKY, Simin Bagheri +3inventors
InventorsPolina SNUGOVSKY, Simin Bagheri, Marianne Romansky, Leonid Snugovsky, Doug Perovic
Life of this patent
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Abstract
A solder composition is provided. The solder composition consists essentially of from about 6.0 to 7.5 percent by weight of bismuth, from about 0.5 to 0.7 percent by weight of copper, and the remainder of the composition being tin.
Claims12
A solder composition consisting essentially of:
- from about 6.0 to 7.5 percent by weight of bismuth;
- from about 0.5 to 0.7 percent by weight of copper;
- and
- the remainder of the composition being tin.
1 more element
Dependencies are inferred from the claim text.