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US 2013/0258601 A1Published application
Heat dissipation apparatus for electronic device
AssigneesFoxconn Technology Co., Ltd., Champ Tech Optical (Foshan) Corporation
InventorJi-Yun QIN
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Abstract
A heat dissipation apparatus adapted for cooling an electronic component received in a metal housing includes a heat sink thermally attached to the electronic component and plural of resilient tabs arranged between the heat sink and the metal housing. The resilient tabs are elastically deformed by the metal housing and thermally contact an inner face of the metal housing.
Claims20
A heat dissipation apparatus for cooling an electronic component received in a metal housing, comprising:
- a heat sink for thermally connecting to the electronic component;
- and
- a plurality of resilient tabs arranged between the heat sink and the metal housing, the resilient tabs being elastic for being elastically deformed by the metal housing and thermally contacting an inner face of the metal housing.
An electronic device, comprising:
- a metal housing;
- an electronic component received in the metal housing;
- a heat sink thermally connected to the electronic component for removing heat from the electronic component;
- and
- a plurality of resilient tabs arranged between the heat sink and the metal housing, the resilient tabs being elastically deformed by the metal housing and thermally contacting an inner face of the metal housing.
2 more elements
Dependencies are inferred from the claim text.