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US 2013/0258600 A1Published application
Thermal interface element and article including the same
AssigneeGeneral Electric Company
InventorsTao Deng, Todd Garrett Wetzel, Kripa Kiran Varanasi, Ambarish Jayant Kulkarni, Boris Russ
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Abstract
An article and method of forming the article is disclosed. The article includes a heat source, a substrate, and a thermal interface element having a plurality of freestanding nanosprings disposed in thermal communication with the substrate and the heat source. The nanosprings of the article include at least one inorganic material and also at least 50% of the nanosprings have a thermal conductivity of at least 1 watt/mK per nano spring.
Claims26
An article comprising:
- a heat source;
- a substrate;
- and
- a thermal interface element reversibly adhesive to the heat source and the substrate, and comprising a plurality of freestanding metallic nanosprings disposed in thermal communication with the substrate and the heat source,
- wherein at least 50% of the nanosprings have a thermal conductivity greater than 1 watt/mK per nano spring.
2 more elements
9-10. (canceled)
A method of preparing an article comprising:
- providing a heat source;
- providing a substrate;
- disposing a reversibly adhesive thermal interface element in between the heat source and the substrate, and comprising a plurality of metallic freestanding nanosprings in thermal communication with the heat source and the substrate,
- wherein at least about 50% of the nanosprings have a thermal conductivity of at least about 1 watt/mK per nano spring.
1 more element
Dependencies are inferred from the claim text.