Active cooling debris bypass fin pack

A computing device comprising:

• a processor configured to execute instructions, whereby heat is generated during execution of the instructions;
• a heat pipe which transfers heat from the processor;
• a fin pack adjacent to and contacting the heat pipe, the fin pack having:
• a housing having a first sidewall, a second sidewall opposite of the first sidewall, a third sidewall between the first and the second sidewalls, a fourth sidewall opposite of the third sidewall and adjacent the first and second sidewalls, and a first open end adjacent the first, second, third, and fourth sidewalls and an second open end opposite of the open first end and adjacent the first second third and fourth sidewalls;
• and
• a set of fins disposed in the housing, the set of fins being arranged to conduct heat from the first sidewall towards the second sidewall, each fin of the set of fins being fixed to the first sidewall and extending towards the second sidewall, at least one of the fins of the set of fins not contacting the second sidewall such that there is an opening between a portion of an edge of the at least one fin and the second sidewall, the portion of the edge of the at least one fin being oriented towards the second sidewall, and the opening between the portion of the edge of the at least one fin and the second sidewall extending along a complete distance between the first open end and the second open end, wherein the portion of the edge of the at least one fin that is oriented towards the second sidewall includes a curve adjacent to the open first end, the curve being configured to allow the debris to move through the opening;
• and
• a blower for blowing air through the fin pack from the first open end towards the second open end to move the heat from the set of fins out of the fin pack, wherein the opening is configured to allow debris to move freely through the fin pack from the first open end to the second open end.