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US 2013/0256922 A1Published application
Method for Fabricating a Semiconductor Device
AssigneeInfineon Technologies AG
InventorsMichael Bauer, Daniel Porwol, Ulrich Wachter
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Abstract
In a method for fabricating a semiconductor device, a carrier and at least one semiconductor chip are provided.
Claims26
A method for fabricating a semiconductor device, the method comprising:
- providing a carrier;
- providing a semiconductor chip;
- placing the semiconductor chip onto the carrier;
- and
- applying a fiber reinforced encapsulant material over the semiconductor chip.
2 more elements
A method for fabricating a semiconductor device, the method comprising:
- providing a carrier;
- providing a semiconductor chip;
- placing the semiconductor chip onto the carrier;
- and
- applying an encapsulant material over the semiconductor chip, the encapsulant material comprising a plurality of fibers embedded therein.
2 more elements
A semiconductor device, comprising:
- a semiconductor chip;
- and
- a fiber reinforced encapsulation layer at least partly covering the semiconductor chip.
A semiconductor device, comprising:
- a semiconductor chip;
- an encapsulation layer at least partly covering the semiconductor chip, wherein the encapsulation layer comprises a plurality of fibers embedded therein.
Dependencies are inferred from the claim text.