Patterned adhesive tape for backgrinding processes
OwnerDingying Xu, Xavier F. Bruninventors
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Abstract
The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be thinned by a backgrinding process using a patterned adhesive tape that reduces slurry seepage and adhesive contamination. The patterned adhesive tape may comprise a base film and adhesive material patterned on the base film such that an edge or periphery portion of the microelectronic device substrate may contact the adhesive material, but substantially no adhesive material contacts interconnectors formed on the microelectronic device substrate.
Claims26
A patterned adhesive tape comprising:
- a base film;
- and
- an adhesive material layer disposed on the base film with at least one opening patterned through the adhesive material layer, wherein the at least one opening is adapted to adhere to an edge portion of a microelectronic device substrate.
An intermediate structure comprising:
- a base film;
- an adhesive material layer disposed on the base film having at least one opening patterned therethrough;
- and
- a microelectronic device substrate having active surface, a edge portion proximate an edge of the microelectronic device substrate, and a plurality of interconnectors extending from the microelectronic device substrate active surface, wherein the microelectronic device edge portion is adhered to the adhesive material layer and wherein the plurality of interconnectors extend into the at least one opening.
A method of thinning a microelectronic device substrate comprising:
- forming a patterned adhesive tape with a base film and an adhesive material layer disposed thereon with at least one opening patterned through the adhesive material layer;
- adhering an edge portion of an active surface of a microelectronic device substrate to the adhesive material layer proximate the adhesive material layer opening, wherein a plurality of interconnectors disposed on the microelectronic substrate active surface extend into the adhesive material layer opening;
- removing a portion of the microelectronic device substrate from a back surface thereof;
- and
- removing the microelectronic device substrate from the patterned adhesive tape.
Dependencies are inferred from the claim text.