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US 2013/0256897 A1Published application
Substrate and semiconductor device
AssigneeOlympus Corporation
InventorsYoshiaki Takemoto, Haruhisa Saito, Hiroshi Kikuchi
Life of this patent
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Abstract
A substrate may include: a base material having a predetermined thickness; an electrode section formed on one side surface in a thickness direction of the base material, and having a plurality of electrodes; and a concave section formed on at least a part of the surface on which the electrode section is formed, on the base material.
Claims5
A substrate comprising:
- a base material having a predetermined thickness;
- an electrode section formed on one side surface in a thickness direction of the base material, and having a plurality of electrodes;
- and
- a concave section formed on at least a part of the surface on which the electrode section is formed, on the base material.
1 more element
A semiconductor device formed by bonding at least two substrates having an electrode section formed thereon,
- wherein at least one of the substrates comprises:
- a base material having a predetermined thickness;
- an electrode section formed on one side surface in a thickness direction of the base material, and having a plurality of electrodes;
- and
- a concave section formed on at least a part of the surface on which the electrode section is formed, on the base material.
2 more elements
Dependencies are inferred from the claim text.