Stacked semiconductor package and method for manufacturing the same

A stacked semiconductor package comprising:

• a plurality of semiconductor package modules each including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, and formed adjoining one another in a matrix type such that through-holes of the semiconductor packages, which connect in a vertical direction, connect in a horizontal direction;
• a main substrate supporting the semiconductor package modules and formed, on a third surface thereof facing the semiconductor package modules, with main connection pads which are aligned with the through-holes communicating in the vertical direction;
• and
• conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.