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US 2013/0256883 A1Published application
Rotated semiconductor device fan-out wafer level packages and methods of manufacturing rotated semiconductor device fan-out wafer level packages
AssigneeIntel Mobile Communications GmbH
InventorsThorsten Meyer, Bernd Waidhas, Thomas Ort
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Abstract
In various aspects of the disclosure, a package may be provided. The package may include at least one semiconductor device rotated about an axis with respect to an edge of the package, at least one bond pad on each semiconductor device, and at least one conductive trace electrically connected to the semiconductor device through the at least one bond pad.
Claims24
A device package, comprising:
- at least one semiconductor device rotated about an axis with respect to an edge of the package;
- at least one bond pad on each semiconductor device;
- and
- at least one conductive trace electrically connected to the semiconductor device through the at least one bond pad.
1 more element
A method of manufacturing a device, the method comprising:
- providing a package;
- providing at least one semiconductor device;
- forming at least one bond pad on one semiconductor device;
- orienting the at least one semiconductor device within the package wherein at least one side of the semiconductor device is not parallel with at least one side of the package;
- and
- forming at least one redistribution trace that electrically connects the semiconductor device with the at least one bond pad.
3 more elements
A device, comprising:
- a package;
- at least one semiconductor device oriented with at least one side that is not parallel with a side of the package;
- and
- at least one redistribution trace electrically connected to the semiconductor device.
1 more element
Dependencies are inferred from the claim text.