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US 2013/0256876 A1Published application
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsUi-hyoung LEE, Moon-gi CHO, Mi-seok PARK, Sun-hee PARK, Hwan-sik LIM, Jin-ho CHOI, Fujisaki ATSUSHI
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a semiconductor chip having a plurality of contact pads on a surface thereof, a plurality of main bumps on the contact pads, respectively. Each of the plurality of main bumps includes a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, and the first solder layer includes an upper portion having an overhang portion.
Claims20
A semiconductor package, comprising:
- a semiconductor chip including a plurality of contact pads on a surface thereof;
- and
- a plurality of main bumps on the contact pads, respectively, each of the plurality of main bumps including a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, the first solder layer including an upper portion having an overhang portion.
A semiconductor package, comprising:
- a semiconductor chip including a plurality of contact pads on a surface thereof;
- and
- a plurality of main bumps on the contact pads, respectively, each of the plurality of main bumps including a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, the first solder layer having a planar shaped top surface that is arranged at a predetermined angle with respect to side walls of the first solder layer.
A semiconductor package, comprising:
- a semiconductor chip including a plurality of contact pads on a surface thereof;
- and
- a plurality of main bumps on the contact pads, respectively, each of the plurality of main bumps including a first pillar layer on one of the contact pads and a first solder layer above the first pillar layer, a middle part of the first solder layer having a greater width than a lower part of the first solder layer and an upper part of the first pillar layer.
Dependencies are inferred from the claim text.