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US 2013/0256873 A1Published application
System, method, and computer program product for preparing a substrate post
AssigneeNVIDIA Corporation
InventorsLeilei Zhang, Abraham F. Yee, Shantanu Kalchuri, Zuhair Bokharey
Life of this patent
Estimating the term…
Abstract
A system, method, and computer program product are provided for preparing a substrate post. In use, a first solder mask is applied to a substrate. Additionally, a post is affixed to each of one or more pads of the substrate. Further, a second solder mask is applied to the substrate.
Claims20
A method, comprising:
- applying a first solder mask to a substrate;
- affixing a post to each of one or more pads of the substrate, wherein a top of each post is dimpled;
- and
- applying a second solder mask to the substrate.
1 more element
(canceled)
A substrate, comprising:
- a first solder mask;
- one or more pads;
- one or more posts, wherein each post is affixed to a corresponding pad, and wherein a top of each post is dimpled;
- and
- a second solder mask.
2 more elements
Dependencies are inferred from the claim text.