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US 2013/0256872 A1Published application
Thermal management of stacked semiconductor chips with electrically non-functional interconnects
AssigneeAdvanced Micro Devices, Inc.
InventorsMichael Su, Bryan Black, Neil McLellan, Joe Siegel, Michael Alfano
Life of this patent
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Abstract
A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.
Claims24
A method of manufacturing, comprising:
- fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip;
- and
- fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip.
A method of manufacturing, comprising:
- stacking a first semiconductor chip on a second semiconductor chip, the first semiconductor chip having a front side facing a back side of the second semiconductor chip, the back side of the second semiconductor chip having plural electrically non-functional interconnects;
- electrically connecting the first and second semiconductor chips with plural electrically functional interconnects between the front side and the back side;
- and
- depositing an insulating material between the first and second semiconductor chips to establish thermal contact with plural electrically non-functional interconnects.
1 more element
An apparatus, comprising:
- a first semiconductor chip having a front side and a back side;
- and
- a first plurality of electrically functional interconnects on the front side and first plurality of electrically non-functional interconnects on the back side.
Dependencies are inferred from the claim text.