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US 2013/0256841 A1Published application
Via plugs
AssigneeCree, Inc.
InventorsVan Mieczkowski, Helmut Hagleitner, William T. Pulz
Life of this patent
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Abstract
The present disclosure relates to providing via plugs in vias of a semiconductor material. The via plugs may be formed of a polymer, such as a polyimide, that can withstand subsequent soldering and operating temperatures. The via plugs effectively fill the vias to prevent the vias from being filled substantially with solder during a subsequent soldering processes.
Claims47
A semiconductor device comprising:
- a semiconductor material comprising a first metallization structure on a first surface and at least one via extending from a second surface of the semiconductor material that is opposite the first surface to the first metallization structure;
- and
- a via plug provided within the at least one via.
A method comprising:
- providing a semiconductor material comprising a first metallization structure on a first surface;
- forming at least one via extending from a second surface of the semiconductor material that is opposite the first surface to the first metallization structure;
- and
- forming a via plug within the at least one via.
1 more element
A method comprising:
- providing a semiconductor material;
- forming at least one via extending through the semiconductor material;
- and
- forming a via plug within the at least one via.
1 more element
Dependencies are inferred from the claim text.