Semiconductor-on-oxide structure and method of forming
AssigneeInternational Business Machines Corporation
InventorsJohn E. Barth, JR., Herbert L. Ho, Babar A. Khan, Kirk D. Peterson
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AssigneeInternational Business Machines Corporation
InventorsJohn E. Barth, JR., Herbert L. Ho, Babar A. Khan, Kirk D. Peterson
Estimating the term…
Semiconductor-on-oxide structures and related methods of forming such structures are disclosed. In one case, a method includes: forming a first dielectric layer over a substrate; forming a first conductive layer over the first dielectric layer, the first conductive layer including one of a metal or a silicide; forming a second dielectric layer over the first conductive layer; bonding a donor wafer to the second dielectric layer, the donor wafer including a donor dielectric and a semiconductor layer; cleaving the donor wafer to remove a portion of the donor semiconductor layer; forming at least one semiconductor isolation region from an unremoved portion of the donor semiconductor layer; and forming a contact to the first conductive layer through donor dielectric and the second dielectric layer.
A method of forming a semiconductor-on-oxide structure, the method comprising:
A semiconductor-on-oxide wafer comprising:
A semiconductor-on-oxide wafer comprising:
Dependencies are inferred from the claim text.