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AssigneeHitachi Cable, Ltd.
InventorsTakuto Yamaguchi, Masahide Okamoto, Osamu Ikeda, Hiromitsu Kuroda, Kazuma Kuroki, Shohei Hata, Yuichi Oda
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The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.
A junction material formed by laminating a first Al-base layer formed of a metal with a main component of Al and a first X-base layer in this order on a first main surface of a Zn-base layer formed of a metal with a main component of Zn, wherein the X-base layer is formed of a metal with a main component selected from Cu, Au, Ag and Sn.
A manufacturing method of junction material, comprising the step of forming a junction material by subjecting a first clad material formed by laminating a first Al-base layer and a first X-base layer formed of a metal with a main component selected from Cu, Au, Ag and Sn on one surface of a first Zn-base layer in this order and a second clad material formed by laminating a second Al-base layer and a second X-base layer formed of a metal with a main component selected from Cu, Au, Ag and Sn on one surface of a second Zn-base layer in this order to clad rolling while having the first and the second Zn-base layers opposite with each other.
A manufacturing method of junction material, comprising the step of forming a junction material by subjecting a Zn-base layer interposed between a first Al-base layer of a first clad material formed by laminating a first X-base layer formed of a metal with a main component selected from Cu, Au, Ag and Sn on one surface of the first Al-base layer and a second Al-base layer of a second clad material formed by laminating a second X-base layer formed of a metal with a main component selected from Cu, Au, Ag and Sn on one surface of the second Al-base material to clad rolling.
Dependencies are inferred from the claim text.