Laser processing method and laser processing apparatus

A laser processing apparatus for forming a laser processed hole in a workpiece configured by bonding a first member formed of a first material and a second member formed of a second material, said laser processed hole extending from said first member to said second member, said laser processing apparatus comprising:

• workpiece holding means for holding said workpiece;
• laser beam applying means for applying a pulsed laser beam to said workpiece held by said workpiece holding means, said laser beam applying means including pulsed laser beam oscillating means for oscillating a pulsed laser beam, power adjusting means for adjusting the power of said pulsed laser beam oscillated by said pulsed laser beam oscillating means, and focusing means for focusing said pulsed laser beam adjusted in power by said power adjusting means onto said workpiece held by said workpiece holding means;
• plasma detecting means for detecting the wavelength of plasma light generated by applying said pulsed laser beam from said laser beam applying means to said workpiece;
• and
• control means for controlling said laser beam applying means according to a detection signal from said plasma detecting means;
• said plasma detecting means including:
• a beam splitter for separating said plasma light into a first optical path and a second optical path;
• a first bandpass filter provided on said first optical path for passing only the wavelength of plasma light generated from said first material;
• a first photodetector for detecting the light passed through said first bandpass filter and outputting a light intensity signal to said control means;
• a second bandpass filter provided on said second optical path for passing only the wavelength of plasma light generated from said second material;
• and
• a second photodetector for detecting the light passed through said second bandpass filter and outputting a light intensity signal to said control means;
• said control means controlling said power adjusting means to continue the application of said pulsed laser beam according to the light intensity signals output from said first and second photodetectors so that when said laser beam applying means is operated to apply said pulsed laser beam to said workpiece to thereby form said laser processed hole extending from said first member to said second member, the power of said pulsed laser beam is set to a first power until the light intensity signal from only said first photodetector is decreased to reach a predetermined value, and the power of said pulsed laser beam is next set to a second power which is lower than said first power and generates no cracks in said first member when the light intensity signal from said first photodetector has reached said predetermined value;
• said control means further controlling said laser beam applying means so that when the light intensity signal from said second photodetector is detected, the application of said pulsed laser beam is stopped.