Pattern forming method and imprint mold manufacturing method
AssigneeKabushiki Kaisha Toshiba
InventorsNaoko KIHARA, Hiroyuki Hieda, Akiko Yuzawa, Norikatsu Sasao, Ryosuke Yamamoto, Yoshiyuki Kamata
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AssigneeKabushiki Kaisha Toshiba
InventorsNaoko KIHARA, Hiroyuki Hieda, Akiko Yuzawa, Norikatsu Sasao, Ryosuke Yamamoto, Yoshiyuki Kamata
Estimating the term…
In one embodiment, a pattern forming method includes: forming a functional layer having a functional group to cross-link a first polymer on a substrate; forming a diblock copolymer layer having the first polymer and a second polymer on the functional layer; self-assembling the diblock copolymer layer to form a self-assembled layer, the self-assembled layer having a first domain corresponding to the first polymer, and a plurality of second domains corresponding to the second polymer and surrounded by or interposed in the first domain; cross-linking the first polymer in the self-assembled layer with the functional group in the functional layer to form a bonding layer disposed in the self-assembled layer and bonded to the functional layer; and washing or etching the self-assembled layer to remain the bonding layer.
A pattern forming method, comprising:
Dependencies are inferred from the claim text.