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US 2013/0256145 A1Published application
Plating bath and method
AssigneesDow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
InventorsDuane R. Romer, Elissei Iagodkine, Inho Lee
Life of this patent
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Abstract
Silver electroplating baths having certain sulfide compounds and methods of electrodepositing a silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide silver-containing solder deposits having reduced void formation and improved within-die uniformity.
Claims10
An electroplating composition comprising:
- a bath-soluble source of silver ions;
- water;
- acid electrolyte;
- and a sulfide compound of the formula:
- Y1—(CR1R2)m—S—(CR3R4)x—S—(CR5R6)n—Y2
- wherein Y1 and Y2 are independently chosen from CO2H, SO3H, PO3H2, CONR7R8 and OH;
- each R1, R2, R5 and R6 is independently chosen from H, (C1-C6)alkyl, CO2H, and hydroxy-substituted (C1-C6)alkyl;
- each R3 and R4 is independently chosen from H and (C1-C6)alkyl;
- m=1-6;
- n=1-6;
- R7 and R8 are independently chosen from H and (C1-C3)alkyl;
- and x=1-6;
- provided that when Y1═OH, m=3;
- provided that when Y2═OH, n=3;
- and provided that when any of R1, R2, R5 and R6 is hydroxy-substituted (C1-C6)alkyl, the hydroxy group is bonded to a carbon atom that is at least gamma to a sulfur atom.
12 more elements
Dependencies are inferred from the claim text.