Wiring board with built-in electronic component and method for manufacturing the same

A method for manufacturing a wiring board with a built-in electronic component, comprising:

• forming on a first surface of a substrate a conductive layer comprising a plurality of linear conductive patterns surrounding a predetermined region of the first surface;
• forming in the predetermined region of the substrate a cavity having an opening at least on the first surface;
• positioning in the cavity an electronic component having a first-side electrode and a second-side electrode on an opposite side of the first-side electrode;
• and
• forming an insulation layer on the first surface of the substrate and the electronic component such that the insulation layer covers the electronic component,
• wherein the forming of the cavity comprises irradiating laser on the plurality of linear conductive patterns such that the region surrounded by the plurality of linear conductive patterns is cut out and that the cavity is formed in the predetermined region of the substrate, and the positioning of the electronic component comprises placing the electronic component in the cavity such that the plurality of linear conductive patterns includes a first linear conductive pattern positioned adjacent to the first-side electrode and a second linear conductive pattern positioned adjacent to the second-side electrode and that the first linear conductive pattern and the second linear conductive pattern are insulated from each other at least through the forming of the insulation layer.