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US 2013/0256004 A1Published application
Deformable Apparatus and Method
AssigneeNokia Corporation
InventorsDarryl COTTON, Samiul Md. HAQUE, Piers ANDREW
Life of this patent
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Abstract
An apparatus and method wherein the apparatus comprises includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.
Claims28
An apparatus comprising:
- a deformable substrate;
- a conductive portion;
- and
- at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.
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A method comprising:
- coupling a conductive portion to a deformable substrate using at least one support such that the conductive portion is spaced from the deformable substrate.
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Dependencies are inferred from the claim text.