Electrical assembly with compliant pins for heat dissipation

Abstract

An electrical assembly comprises a substrate having a dielectric layer and one or more electrically conductive traces overlying the dielectric layer. An electrical component is mounted on a first side of the substrate. The electrical component is capable of generating heat. A plurality of conductive through holes in the substrate are located around a perimeter of the electrical component. The conductive through holes are connected to a conductive trace for heat dissipation. A cooling cavity has bores that face a second side of the substrate opposite the first side. A plurality of respective compliant pins are inserted into corresponding conductive through holes and the bores, wherein a generally exposed portion of the compliant pin is exposed to air or a coolant liquid within the cooling cavity.

Dependencies are inferred from the claim text.