Method For Detaching A Semiconductor Chip From A Foil

Method for detaching a semiconductor chip from a foil by means of a chip gripper and a die ejector, with the die ejector comprising first plates having a straight supporting edge and second plates having an L-shaped supporting edge, with the supporting edges of the plates in an initial position forming a supporting plane on which the foil rests, comprising the following steps:

• A) lifting of the plates, so that the supporting edges of the plates assume a height H1 above the surface of the cover plate;
• B) lowering of a first pair of plates with L-shaped supporting edge;
• C) optionally, lowering of a second pair of plates with L-shaped supporting edge;
• D) lifting of the plates that have not yet been lowered, so that the supporting edges of the plates that have not yet been lowered assume a height H2>H1 above the surface of the cover plate;
• E) staggered lowering of plates that have not yet been lowered in a specific sequence, with at least one or several plates not being lowered;
• F) optionally, lowering of at least the plates that have not yet been lowered, so that the supporting edges of the plates that have not yet been lowered assume a height H3<H2 above the surface of the cover plate;
• G) lowering of the plates that have not yet been lowered until all plates are lowered, and
• H) moving away of the chip gripper with the semiconductor chip,
• wherein the chip gripper is positioned above the semiconductor chip and lowered until it touches the semiconductor chip at the latest before the lowering of the last three plates.