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US 2013/0252516 A1Published application
Polishing pad and polishing method
AssigneeKabushiki Kaisha Toshiba
InventorsShiro MISHIMA, Satoshi MURAKAMI
Life of this patent
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Abstract
According to one embodiment, there is provided a polishing pad having a surface for the polishing processing of a polishing workpiece. Here, the polishing pad is made of a plate-shaped thermal shrinking material, and it has a half-cut portion cut to a particular depth from one principal surface.
Claims9
A polishing pad comprising:
- a surface for polishing processing of a workpiece, and
- a half-cut portion cut to a particular depth from one principal surface, wherein
- the polishing pad is made of a plate-shaped thermal shrinking material.
A polishing apparatus comprising:
- a rotatable polishing table;
- a polishing pad provided on the polishing table;
- a feeding nozzle configured to feed a slurry to the polishing pad;
- a polishing head that can hold a workpiece;
- wherein the polishing pad comprising:
- a surface for polishing processing of the workpiece, and
- a half-cut portion cut to a particular depth from one principal surface, wherein
- the polishing pad is made of a plate-shaped thermal shrinking material.
5 more elements
A polishing method comprising:
- feeding slurry to a principal surface of a plate-shaped polishing pad while the polishing pad is driven to rotate in the in-plane direction, the polishing pad being made of a thermal shrinking material and having a half-cut portion cut to a particular depth from one principal surface, and
- polishing a surface of a workpiece with being in contact with the principal surface of the polishing pad, shrinking the polishing pad in the region from the surface of the principal surface of the polishing pad to a particular depth, thereby forming a groove with a certain shape and a certain size on the contact portion of the half-cut portion with the polishing workpiece.
Dependencies are inferred from the claim text.