Wafer Holder With Varying Surface Property
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Hung Lin, Li-Ting Wang, Tze-Liang Lee
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYi-Hung Lin, Li-Ting Wang, Tze-Liang Lee
Estimating the term…
An apparatus, a system and a method are disclosed. An exemplary apparatus includes a first portion configured to hold an overlying wafer. The first portion includes a central region and an edge region circumscribing the central region. The first portion further including an upper surface and a lower surface. The apparatus further includes a second portion extending beyond an outer radius of the wafer. The second portion including an upper surface and a lower surface. The lower surface of the first portion in the central region has a first reflective characteristic. The lower surface of the first portion in the edge region and the second portion have a second reflective characteristic.
An apparatus comprising:
A wafer processing system, comprising:
A method comprising:
Dependencies are inferred from the claim text.