Electro-Depositing Metal Layers of Uniform Thickness
OwnerGeorge Hradilinventor
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Abstract
The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.
Claims14
In an electrodeposition process for electroplating at least one uniform layer of a metal on an cathodic substrate in an electroplating bath containing a suitable electroplating solution, the improvement comprising conducting the electroplating process (1) without external agitation of the electroplating solution and (2) under an effective current density or effective voltage to obtain the at least one uniform layer of a semi-conducting metal on the substrate.
In an electrodeposition process for electroplating at least one metal layer on an cathodic substrate in an electroplating bath containing a suitable electroplating solution, the improvement comprising conducting the electroplating process (1) without external agitation of the electroplating solution and (2) under an effective constant current density or effective constant voltage to obtain at least one uniform layer of metal on the substrate and (3) disposing the cathodic substrate within the bath so that its longitudinal axis is disposed horizontally and the anode and the cathodic substrate and the anode are in parallel, closely spaced-apart relation to each other in the bath.
Dependencies are inferred from the claim text.