Corrosion resistant coating for copper substrate
AssigneeSeagate Technology LLC
InventorsYongping Gong, Kristoffer Steven Scheponik
Life of this patent
Estimating the term…
Abstract
A protecting coating for a copper substrate is disclosed. The coating comprises seed layer comprising titanium ions that forms an “alloy-like” structure with the copper substrate. The coating further comprises a first layer of carbon disposed on the seed layer comprising titanium ions. A second layer comprising titanium is disposed on the first layer of carbon, and a second layer of carbon is disposed on the second layer comprising titanium.
Claims20
A manufactured article comprising a copper substrate and a corrosion resistant coating, the coating comprising a seed layer of titanium ions and a first layer of carbon.
A component comprising:
- a copper substrate;
- a coating comprising a seed layer of titanium ions disposed on the copper substrate and a first layer of carbon disposed on the seed layer of titanium.
A method comprising:
- forming a seed layer of titanium ions on a copper surface;
- and
- forming a first layer of carbon on the seed layer of titanium.
Dependencies are inferred from the claim text.