Method for producing a surface-mountable semiconductor component

A method of producing a surface-mountable semiconductor component comprising:

• providing an auxiliary carrier made with a plastics material;
• applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier;
• enclosing the optoelectronic component and the insert in a common molding, wherein
• the molding covers the optoelectronic component and the insert form-fittingly at least in places, the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding;
• removing the auxiliary carrier;
• and
• producing individual surface-mountable semiconductor components by severing the molding.

The surface-mountable semiconductor component comprising:

• at least one optoelectronic component with a radiation passage face;
• at least one reflector which reflects electromagnetic radiation impinging thereon and generated by the optoelectronic component when in operation, wherein the reflector surrounds the optoelectronic component in the lateral direction at least in places and the reflector is or comprises a terminal point for the optoelectronic component;
• a radiation-transmissive molding in direct contact at least in places with the optoelectronic component and the reflector;
• a bearing surface formed at least in places by a surface of the molding, wherein
• the optoelectronic component and the reflector are not in direct contact with one another and connect together mechanically by the molding, and
• the reflector surrounds the optoelectronic component at least in places in the lateral direction.

A surface-mountable semiconductor component comprising:

• at least one optoelectronic component with a radiation passage face;
• at least one insert formed of two separate components spaced from one another in lateral direction such that they form a cavity, and the insert is or comprises a terminal point for the optoelectronic component;
• a reflective molding in direct contact at least in places with the optoelectronic component at side faces and with the insert;
• a bearing surface formed at least in places by a surface of the molding, wherein
• the optoelectronic component and the insert are not in direct contact with one another and connect together mechanically by the molding, and
• the radiation passage face of the optoelectronic component is free of the molding.