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US 2013/0240929 A1Published application
Semiconductor component and method for producing a semiconductor component
AssigneeOSRAM Opto Semiconductors GmbH
InventorsMichael Kruppa, Simon Jerebic
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Abstract
A semiconductor component includes an optoelectronic semiconductor chip and an optical element arranged on a radiation passage area of the semiconductor chip, wherein the optical element is based on a highly refractive polymer material.
Claims17
A semiconductor component comprising an optoelectronic semiconductor chip and an optical element arranged on a radiation passage area of the semiconductor chip, wherein the optical element is based on a highly refractive polymer material.
A method of producing, a semiconductor component comprising:
- a) providing an optoelectronic semiconductor chip;
- b) applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material;
- c) precuring the molding compound at a temperature of at most 50° C.;
- and
- d) curing the molding compound.
2 more elements
(canceled)
Dependencies are inferred from the claim text.